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Capabilites

PCB Capabilities:

NO

Item

Craft Ability

1

Surface Finish

HASL, Immersion Gold,Flash Gold,Gold Plating, OSP,Immersion Tin etc.

2

Layer

2-30 layers

3

Minimum Linewidth

3mil

4

Minimum Line space

3mil

5

Min space between pad to pad

3mil

6

Minimum hole diameter

0.10 mm

7

Min bonding pad diameter

10mil

8

Max proportion of drilling hole and board thickness

1:12.5

9

Max size of finish board

23inch*35inch

10

Rang of finish baord’s Thickness

0.21-7.0mm

11

Minimun thickness of soldermask

10um

12

Soldermask

Green, Yellow, Black, Blue, White, Red ,transparent photosensitive ,soldermask ,Strippable soldermask

13

Minimum linewidth of Idents

4mil

14

Min Height of Idents

25mil

15

Color of silk-screen

White,Yellow,Black

16

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++

17

E-Testing

100% E-Testing;High Voltage Testing

18

Material for PCB

High Tg Material;High Frequence(ROGERS ,TEFLON ,TACONIC ,ARLON) ;Halogen-free Material

19

Other test

Impedance,,Testing,Resistance,,Testing, Microsection etc.,

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

PCB Assembly Machinery:

Main
production equipment
Line 1 Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Taiji soldering machine(11 ZONES)
Line 2 Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Gelin soldering machine (5 ZONES)
Line 3 SPP-G1 + JUKIKE2060CM + YV100XE + MPA 3 + FLEXTRONICS REFLOWER (5 ZONES)
Line 4 DEK ELA + JUKIKE2060CM + YV100XE + MPA-3 + KELONG REFLOWER (8 ZONES)
Line 5 DEK ELA +YV100XE + YV100XE + 2060+ HELLER 1800W (8 ZONES)
Line 6 SPPD + TCM3500Z + HELLER 1800EXL(8 ZONES)
Line 7 America PACEST350 BGA 2 sets of counter- repairing stations
Line 8 Bonding machines, ASM-AB599 ( 5 sets ) ASM-AB520(6 sets) ASM-510C(5sets)
SMT speed CHIP components SMT speed 0.3S/ pcs, max speed 0.16S/ pcs.
SMT Smallest SMT components size can reach to 0201, accuracy can reach to 0.1mm. can SMT PLCC 、 QFP 、 BGA 、 CSP and so on,leg distance can reach 0.3mm。We have advanced technology in SMT supper-thin PCB, FPC gold finger and so on. Can SMT/DIP mixed SMT/DIP TFT, drive –engine, mobile main board, battery protection circuit and some other difficult products and components Small order manufacturing from pcb manufacture –material purchasing –SMT/DIP processing –testing/ package—7days of delivery.